电子封装中的热-流体耦合模拟
题目:电子封装中的热-流体耦合模拟出处:《ANSYS高级工程有限元分析范例精选》P300页 第14章
注释:小弟无意中看到这题,因为没学过CFD,感兴趣,就做来试试,发现书上印错几处,遂改正。特把改正后的命令流和结果奉上,大家一起进步。小弟还有问题若干,稍后提出,望众位大虾指点!!!
KEYW,PR_CFD,1
/UNITS,SI
/FILNAME,MCMCFD
/TITLE,2D THERMAL AND CFD SIMULATION OF MULTICHIP MODULE
*SET,D1_LENGTH,8E-3
*SET,D1_HEIGHT,0.65E-3
*SET,D2_LENGTH,5E-3
*SET,D2_HEIGHT,0.65E-3
*SET,BS1_RADIUS,0.15E-3
*SET,BS1_DIST,0.75E-3
*SET,BS1_NB,10
*SET,BS1_HEIGHT,0.2E-3
*SET,BS1_SIDE,0.625E-3
*SET,BS2_RADIUS,BS1_RADIUS
*SET,BS2_DIST,0.75E-3
*SET,BS2_NB,6
*SET,BS2_HEIGHT,0.2E-3
*SET,BS2_SIDE,0.625E-3
*SET,SUB_LENGTH,40E-3
*SET,SUB_HEIGHT,1.5E-3
*SET,BS3_RADIUS,0.3E-3
*SET,BS3_DIST,1.27E-3
*SET,BS3_NB,26
*SET,BS3_HEIGHT,0.4E-3
*SET,BS3_SIDE,4.125E-3
*SET,D_DIST,11.5E-3
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*SET,PCB_HEIGHT,1.5E-3
*SET,HS_LENGTH,40E-3
*SET,HS_THICK,1.5E-3
*SET,SA_HEIGHT,0.15E-3
*SET,TIM_HEIGHT,0.15E-3
*SET,COOL_LENGTH,60E-3
*SET,COOL_THICK,1E-3
*SET,COOL_HEIGHT,6E-3
*SET,IN_INNER,4E-3
*SET,IN_OUTER,6E-3
*SET,IN_DIST,4E-3
*SET,IN_HEIGHT,10E-3
*SET,OUT_INNER,4E-3
*SET,OUT_OUTER,6E-3
*SET,OUT_DIST,4E-3
*SET,OUT_HEIGHT,10E-3
/PREP7
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ASEL,R,LOC,X,0,D2_LENGTH
AGEN,BS2_NB,ALL,,,BS2_DIST,,,,0
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RECT,0,D2_LENGTH,0,TIM_HEIGHT
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RECT,0,D1_LENGTH/2,0,TIM_HEIGHT
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RECT,0,HS_LENGTH/2,0,HS_THICK
*SET,HS_HEIGHT,TIM_HEIGHT+D1_HEIGHT+BS1_HEIGHT-SA_HEIGHT
RECT,SUB_LENGTH/2-HS_THICK,SUB_LENGTH/2,0,-HS_HEIGHT
RECT,SUB_LENGTH/2-HS_THICK,SUB_LENGTH/2,-(HS_HEIGHT+SA_HEIGHT),-HS_HEIGHT
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ASEL,A,,,82
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FINISH
/POST1
SET,LAST
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FINISH
Re:电子封装中的热-流体耦合模拟
下面是温度图Re:电子封装中的热-流体耦合模拟
下面是速度图Re:电子封装中的热-流体耦合模拟
小弟的问题很菜的。:)该例子只设了一个fluid单元,且把封装中的散热元件都aatt成fluid单元了。
这样行吗?小弟不解
我请教过一位仁兄,也觉不妥。
望众位斑竹、众家兄弟指教!
小弟打以上那些命令也很辛苦的,狂谢!!!
Re:电子封装中的热-流体耦合模拟
晕,命令流有个量定义为S B,可论坛显示不了,显示***我改个别的词吧!!!
Re:电子封装中的热-流体耦合模拟
我觉得这里是选用了一种单元,但是是十种不同的材料,所以要设置各种材料的导热系数!!Re:电子封装中的热-流体耦合模拟
如果都是一个单元,那么固体的热学性能不是和流体一样了?求出来肯定不对的!
期待正解!
Re:电子封装中的热-流体耦合模拟
这例子中流体温度不是恒温,而且设置材料号1是为了表明是流体单元属性,但是我不明白的是:为什么温度15度施加在所有的边上,这样不是温度就不会变化了吗?不太明白!Re:电子封装中的热-流体耦合模拟
我把这个例子的求解改成瞬态后,老是出现材料2的错误!怎么会事??
Re:电子封装中的热-流体耦合模拟
恳请高手予以解答!谢谢!!Re:电子封装中的热-流体耦合模拟
guliuxinyong wrote:小弟的问题很菜的。:)
该例子只设了一个fluid单元,且把封装中的散热元件都aatt成fluid单元了。
这样行吗?小弟不解
我请教过一位仁兄,也觉不妥。
望众位斑竹、众家兄弟指教!
小弟打以上那些命令也很辛苦的,狂谢!!!
1.fluid141,142单元可以同时解决流体与固体网格划分(可以参照帮助文件),所以这个没有问题。
Re:电子封装中的热-流体耦合模拟
zhaodaibin wrote:如果都是一个单元,那么固体的热学性能不是和流体一样了?
求出来肯定不对的!
期待正解!
是由区分的,只有材料编号为1的物体才为流体,其余的都默认为固体;
Re:电子封装中的热-流体耦合模拟
gxx917 wrote:这例子中流体温度不是恒温,而且设置材料号1是为了表明是流体单元属性,但是我不明白的是:为什么温度15度施加在所有的边上,这样不是温度就不会变化了吗?不太明白!
15度只是入口流体的温度,并不是指所有的边上。
Re:电子封装中的热-流体耦合模拟
我做了一遍发现温度是加在所有的边上了!这样稳态流场计算出来的温度分布,是最终的温度分布吗?请教楼上!! 发现一个论坛,专门作封装模拟的,有兴趣的不妨进来看看http://www.iccae.com
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