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I need calculate heat tranfer coefficient for an electronic power housing. The housing outer side has complex geometry. My idea is only take this housing without inside electronic devices and define certain temperature as boundary condition, using Ansys/CFD to calculation heat transfer coefficient once for free convection and once for forced convection(airflow velocity is known. Anybody can give advice, is my idea ok, whether I missing something?!
I am really new in thermal/CFD. Many thanks! |
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