老帖还能受到如此关注， 看来接触热阻是个问题，我也抛砖引玉一下。
老外的培训资料上有这么一段话：
By default, perfect thermal contact conductance between parts is assumed, meaning no temperature drop occurs at the interface.
Numerous conditions can contribute to less than perfect contact conductance:
surface flatness
surface finish
oxides
entrapped fluids
contact pressure
surface temperature
use of conductive grease
– The amount of heat flow across a contact interface is defined by the contact heat flux q:
q=Tcc（Tt-Tc）
– where Tcontact is the temperature of a contact “node” and Ttarget is the temperature of the corresponding target “node”.
– By default, TCC is set to a relatively ‘high’ value based on the largest material conductivity defined in the model KXX and the diagonal of the overall geometry bounding box ASMDIAG.
–
– 大意是：理想的零件间的接触传热系数假定在接触界面上没有温度降。接触热阻使接触的两个表面在穿过界面上有温度降，这种温差是由两表面间的不良接触产生，由此产生有限热传导，受到影响因素包括：表面的平面度、表面磨光、氧化物、残存流体、接触压力、表面温度、导热脂的使用等。
– 一般情况下，工程师在分析时都希望能够得知界面的温差，尤其一些LED照明设计工程师对于热阻更加感兴趣，因为热阻会很清楚的标记在产品上。此时在ansys中有一个简便的方法设置TCC：
– TCC=1/接触热阻x接触面积
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发表于 2011-3-30 12:53:51
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