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发表于 2007-3-13 02:02:03
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来自 美国
In anays, there are two ways to have thermal contact resistance:
(1) make one very thin layer sandwiched between the two materials and set its thermal conductivity k = d/Rth, where d is the thin layer thickness and Rth is the thermal resistance value with unit of m^2*K/W. If you are doing transient analysis, also set specific heat close to 0 (you may ask youself why).
(2) you can use contact element to make thermal contact resistance. See ANSYS online help. Note, it use the thermal contact conductance = 1/Rth.
Some comments are shown below:
原帖由 mmmhhhkkk 于 2007-3-12 16:07 发表
是不是就是把结合面的导热系数用convection设置在结合面上呢?
Please think carefully. You are confused from physics. 导热系数 and convection coefficient have different units so your argument is wrong even from the physics.
那是设置接触的两个面还是就是只设置在一个面上就可以了呢?
接触热阻是不是试验可以测出来呢?
Yes, it is usually experimentally measured - some typpical vaule: the thermal contact resistance between thermal paste and CPU is around ~10e-5 to 10e-4 m^2-K/W , roughly equal to the thermal resistance of 1mm silicon layer.
恳请版主答复,本人qq35380363,现在也正在为这个问 ... |
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